THE PREPARATION OF ENCAPSULATING MATERIAL USED FOR ELECTRONIC ELEMENTS

doi:10.3969/j.issn.1009-444X.2001.02.014

Volume 15 Issue 2

Jun. 2001

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Article Navigation > Journal of Shanghai University of Engineering Science > 2001 > 15(2): 150-153

THE PREPARATION OF ENCAPSULATING MATERIAL USED FOR ELECTRONIC ELEMENTS[J]. Journal of Shanghai University of Engineering Science, 2001, 15(2): 150-153. doi: 10.3969/j.issn.1009-444X.2001.02.014

Citation:

THE PREPARATION OF ENCAPSULATING MATERIAL USED FOR ELECTRONIC ELEMENTS[J]. Journal of Shanghai University of Engineering Science, 2001, 15(2): 150-153. doi: 10.3969/j.issn.1009-444X.2001.02.014

THE PREPARATION OF ENCAPSULATING MATERIAL USED FOR ELECTRONIC ELEMENTS[J]. Journal of Shanghai University of Engineering Science, 2001, 15(2): 150-153. doi: 10.3969/j.issn.1009-444X.2001.02.014

Citation:

THE PREPARATION OF ENCAPSULATING MATERIAL USED FOR ELECTRONIC ELEMENTS[J]. Journal of Shanghai University of Engineering Science, 2001, 15(2): 150-153. doi: 10.3969/j.issn.1009-444X.2001.02.014

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