Volume 19 Issue 3
Sep.  2005
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2005  >  19(3): 198-200
CHEN Yue-hui, WANG Ji-hu, WANG Jin-cheng, WU Yun-feng, WU Jian-rong. Research of Conductive Mechanism of Copper Powder Acrylate Adhesive[J]. Journal of Shanghai University of Engineering Science, 2005, 19(3): 198-200. doi: 10.3969/j.issn.1009-444X.2005.03.002
Citation: CHEN Yue-hui, WANG Ji-hu, WANG Jin-cheng, WU Yun-feng, WU Jian-rong. Research of Conductive Mechanism of Copper Powder Acrylate Adhesive[J]. Journal of Shanghai University of Engineering Science, 2005, 19(3): 198-200. doi: 10.3969/j.issn.1009-444X.2005.03.002
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Research of Conductive Mechanism of Copper Powder Acrylate Adhesive

doi: 10.3969/j.issn.1009-444X.2005.03.002
  • Publish Date: 2005-09-30

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