Volume 21 Issue 2
Jun.  2007
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2007  >  21(2): 121-125
YI Qizhong, GU Yonghua. Experimental Study on Material Formulation and Curing Process for Epoxy Resin Mold[J]. Journal of Shanghai University of Engineering Science, 2007, 21(2): 121-125. doi: 10.3969/j.issn.1009-444X.2007.02.007
Citation: YI Qizhong, GU Yonghua. Experimental Study on Material Formulation and Curing Process for Epoxy Resin Mold[J]. Journal of Shanghai University of Engineering Science, 2007, 21(2): 121-125. doi: 10.3969/j.issn.1009-444X.2007.02.007
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Experimental Study on Material Formulation and Curing Process for Epoxy Resin Mold

doi: 10.3969/j.issn.1009-444X.2007.02.007
  • Publish Date: 2007-06-30

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