Volume 22 Issue 3
Sep.  2008
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2008  >  22(3): 235-238,253
SHI Kun, YU Zhi-shui, WANG Fu-xin. Study on Transient Liquid Phase Bonding Processes and Interlayer[J]. Journal of Shanghai University of Engineering Science, 2008, 22(3): 235-238,253. doi: 10.3969/j.issn.1009-444X.2008.03.011
Citation: SHI Kun, YU Zhi-shui, WANG Fu-xin. Study on Transient Liquid Phase Bonding Processes and Interlayer[J]. Journal of Shanghai University of Engineering Science, 2008, 22(3): 235-238,253. doi: 10.3969/j.issn.1009-444X.2008.03.011
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Study on Transient Liquid Phase Bonding Processes and Interlayer

doi: 10.3969/j.issn.1009-444X.2008.03.011
  • Publish Date: 2008-09-30

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