Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate

CHEN Jie; YU Zhi-shui; LIU Lei; XIANG Feng

doi:10.3969/j.issn.1009-444X.2009.03.021

Volume 23 Issue 3

Sep. 2009

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Article Navigation > Journal of Shanghai University of Engineering Science > 2009 > 23(3): 277-281

CHEN Jie, YU Zhi-shui, LIU Lei, XIANG Feng. Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate[J]. Journal of Shanghai University of Engineering Science, 2009, 23(3): 277-281. doi: 10.3969/j.issn.1009-444X.2009.03.021

Citation:

CHEN Jie, YU Zhi-shui, LIU Lei, XIANG Feng. Current Research Status of Reactive Wetting and Interface Structure of Sn-based Solders on Cu Substrate[J]. Journal of Shanghai University of Engineering Science, 2009, 23(3): 277-281. doi: 10.3969/j.issn.1009-444X.2009.03.021