JING Jing-nan, YU Zhi-shui, ZUO Shi-wei. Study on Dissolution and Wettability Properties of Lead-Free Solders[J]. Journal of Shanghai University of Engineering Science, 2010, 24(2): 163-166. doi: 10.3969/j.issn.1009-444X.2010.02.017
Citation:
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JING Jing-nan, YU Zhi-shui, ZUO Shi-wei. Study on Dissolution and Wettability Properties of Lead-Free Solders[J]. Journal of Shanghai University of Engineering Science, 2010, 24(2): 163-166. doi: 10.3969/j.issn.1009-444X.2010.02.017
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JING Jing-nan, YU Zhi-shui, ZUO Shi-wei. Study on Dissolution and Wettability Properties of Lead-Free Solders[J]. Journal of Shanghai University of Engineering Science, 2010, 24(2): 163-166. doi: 10.3969/j.issn.1009-444X.2010.02.017
Citation:
|
JING Jing-nan, YU Zhi-shui, ZUO Shi-wei. Study on Dissolution and Wettability Properties of Lead-Free Solders[J]. Journal of Shanghai University of Engineering Science, 2010, 24(2): 163-166. doi: 10.3969/j.issn.1009-444X.2010.02.017
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Study on Dissolution and Wettability Properties of Lead-Free Solders