Volume 27 Issue 1
Mar.  2013
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2013  >  27(1): 76-81
FANG Jiaqiang, YU Zhishui, CHANG Wenlong, WANG Bo, JIANG Heming. Analysis and Research on Electro-Migration Phenomenon in Solder Joints for Microelectronics Packaging[J]. Journal of Shanghai University of Engineering Science, 2013, 27(1): 76-81. doi: 10.3969/j.issn.1009-444X.2013.01.017
Citation: FANG Jiaqiang, YU Zhishui, CHANG Wenlong, WANG Bo, JIANG Heming. Analysis and Research on Electro-Migration Phenomenon in Solder Joints for Microelectronics Packaging[J]. Journal of Shanghai University of Engineering Science, 2013, 27(1): 76-81. doi: 10.3969/j.issn.1009-444X.2013.01.017
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Analysis and Research on Electro-Migration Phenomenon in Solder Joints for Microelectronics Packaging

doi: 10.3969/j.issn.1009-444X.2013.01.017
  • Publish Date: 2013-03-30

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