Research on Brazing Technologies of Copper with Ag-Cu Eutectic Solder in Vacuum

LIU Haobo; QIN Youqiong; SUN Lei; MU Bingbing; ZHANG Difan; SHI Jixiang

doi:10.3969/j.issn.1009-444X.2013.02.012

Volume 27 Issue 2

Jun. 2013

Turn off MathJax

Article Contents

Article Navigation > Journal of Shanghai University of Engineering Science > 2013 > 27(2): 147-150

LIU Haobo, QIN Youqiong, SUN Lei, MU Bingbing, ZHANG Difan, SHI Jixiang. Research on Brazing Technologies of Copper with Ag-Cu Eutectic Solder in Vacuum[J]. Journal of Shanghai University of Engineering Science, 2013, 27(2): 147-150. doi: 10.3969/j.issn.1009-444X.2013.02.012

Citation:

LIU Haobo, QIN Youqiong, SUN Lei, MU Bingbing, ZHANG Difan, SHI Jixiang. Research on Brazing Technologies of Copper with Ag-Cu Eutectic Solder in Vacuum[J]. Journal of Shanghai University of Engineering Science, 2013, 27(2): 147-150. doi: 10.3969/j.issn.1009-444X.2013.02.012