Volume 28 Issue 3
Sep.  2014
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2014  >  28(3): 244-247
ZHENG Shanshan, QIN Youqiong, SUN Lei, BAI Yongzhen, LIAO Sen. Effect of Brazing Temperature on Microstructure of SiC/YG8 Joints[J]. Journal of Shanghai University of Engineering Science, 2014, 28(3): 244-247. doi: 10.3969/j.issn.1009-444X.2014.03.012
Citation: ZHENG Shanshan, QIN Youqiong, SUN Lei, BAI Yongzhen, LIAO Sen. Effect of Brazing Temperature on Microstructure of SiC/YG8 Joints[J]. Journal of Shanghai University of Engineering Science, 2014, 28(3): 244-247. doi: 10.3969/j.issn.1009-444X.2014.03.012
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Effect of Brazing Temperature on Microstructure of SiC/YG8 Joints

doi: 10.3969/j.issn.1009-444X.2014.03.012
  • Publish Date: 2014-09-30

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