Volume 24 Issue 3
Sep.  2010
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Article Navigation >  Journal of Shanghai University of Engineering Science  > 2010  >  24(3): 253-256
TANG Jia, CAO Yang-gen. CAE Modeling of IC-Packaging Mould Based on Moldex3D[J]. Journal of Shanghai University of Engineering Science, 2010, 24(3): 253-256. doi: 10.3969/j.issn.1009-444X.2010.03.016
Citation: TANG Jia, CAO Yang-gen. CAE Modeling of IC-Packaging Mould Based on Moldex3D[J]. Journal of Shanghai University of Engineering Science, 2010, 24(3): 253-256. doi: 10.3969/j.issn.1009-444X.2010.03.016
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CAE Modeling of IC-Packaging Mould Based on Moldex3D

doi: 10.3969/j.issn.1009-444X.2010.03.016
  • Publish Date: 2010-09-30

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