导电金属有机框架在热电材料领域的研究进展

吴鑫; 张帆; 郑琦; 王连军

导电金属有机框架在热电材料领域的研究进展

东华大学材料科学与工程学院，上海 201620

详细信息

作者简介:
吴鑫：吴　鑫（1995−），女，在读博士，研究方向为热电材料. E-mail：2180281@mail.dhu.edu.cn

通讯作者:
郑　琦（1986−），女，副教授，博士，研究方向为晶态功能材料. E-mail：qi.zheng@dhu.edu.cn

中图分类号: TG 456
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- 被引次数: 0
出版历程
- 收稿日期: 2020-10-13
- 刊出日期: 2021-03-30

Research Progress of Conductive Metal-Organic Frameworks in Thermoelectric Materials

College of Materials Science and Engineering, Donghua University, Shanghai 201620, China

摘要

摘要: 金属有机框架（MOFs）是一种高度有序的晶体多孔固体材料，通过一系列实验设计策略，可构建高电导率的MOFs，其是极具潜力的热电材料. 从导电MOFs的结构、导电机制及其热电应用几个方面阐述导电MOFs在热电材料领域的研究进展，同时总结其在热电材料领域面临的挑战和发展方向，为新型MOFs基热电材料的开发提供参考.
- 导电金属有机框架 /
- 热电材料 /
- 导电机制 /
- 电荷传输
Abstract: Metal-organic frameworks (MOFs) are highly-ordered and crystalline porous materials. Through a series of experimental design strategies, MOFs with high conductivity can be constructed , which is a great potential thermoelectric materials. The research progress of conducting MOFs in the field of thermoelectric materials were reviewed from the structure, conduction mechanism and thermoelectric applications of conducting MOFs. Meanwhile, the challenges and development direction of conducting MOFs in the field of thermoelectric materials were summarized, which can provide a reference for the development of new MOFs-based thermoelectric materials.
- metal-organic frameworks (MOFs) /
- thermoelectric materials /
- conducting mechanism /
- charge transport

HTML全文

图 1 Cu₃(HHTP)₂薄膜的电化学沉积和热电性能表征^[9]

Figure 1. Electrochemical deposition and thermoelectric characterization of Cu₃(HHTP)₂ thin film

下载: 全尺寸图片幻灯片

图 2 Zn-HAB结构及性能^[11]

Figure 2. Structure and property of Zn-HAB

下载: 全尺寸图片幻灯片

图 3 TCNQ@Cu₃(BTC)₂薄膜热电性能^[10]

Figure 3. Thermoelectric characterization of TCNQ@Cu₃(BTC)₂ thin films

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图 4 Zr-MOF/PAn合成示意图^[27]

Figure 4. Schematic diagram of Zr-MOF/PAn Composites

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表 1 导电MOFs基热电材料及性能汇总

Table 1. A summary of properties of conductive MOF based thermoelectric materials

导电MOFs	样品类型	导电机制	热导率 / (W ·(m·K)⁻¹)	电导率 / (S ·cm⁻¹)	塞贝克系数 / (μV ·K⁻¹)	功率因子 / (μW·m⁻¹·K⁻¹)
Ni₃(HITP)₂^[25]	压片	扩展共轭	0.21	58.8	−11.9	0.831
Cu₃(HHTP)₂^[9]	压片	扩展共轭	—	3.80×10⁻³	−7.24	2×10⁻⁵
Cu₃(HHTP)₂^[9]	薄膜	扩展共轭	—	2.28×10⁻³	−121.4	3.15×10⁻³
Cu₃(BHT)^[26]	薄膜	扩展共轭	0.24	2 000	−21	88.2
Ni-PTC^[18]	压片	扩展共轭	0.20	9.0	47	2.0
Zn-HAB^[11]	压片	扩展共轭	—	8.6×10⁻⁴	200	3.44×10⁻³
TCNQ@Cu₃(BTC)₂^[10]	薄膜	客体促进	0.27	4×10⁻³	375	0.057
Zr-MOF/PAn/PSS^[27]	薄膜	客体促进	0.24	0.021	−17780	664
ZIF-67@CNT^[28]	薄膜	客体促进	4.10±0.60	825.7±12.0	55.6±0.9	255.6±11.8

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